JPH0286135U - - Google Patents
Info
- Publication number
- JPH0286135U JPH0286135U JP1988165604U JP16560488U JPH0286135U JP H0286135 U JPH0286135 U JP H0286135U JP 1988165604 U JP1988165604 U JP 1988165604U JP 16560488 U JP16560488 U JP 16560488U JP H0286135 U JPH0286135 U JP H0286135U
- Authority
- JP
- Japan
- Prior art keywords
- bonding tool
- lead
- film carrier
- pressurizing
- connection device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988165604U JPH0286135U (en]) | 1988-12-21 | 1988-12-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988165604U JPH0286135U (en]) | 1988-12-21 | 1988-12-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0286135U true JPH0286135U (en]) | 1990-07-09 |
Family
ID=31452243
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988165604U Pending JPH0286135U (en]) | 1988-12-21 | 1988-12-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0286135U (en]) |
-
1988
- 1988-12-21 JP JP1988165604U patent/JPH0286135U/ja active Pending